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ICSOFT-EA is part of ICSOFT, the 11th International Joint Conference on Software Technologies.
Registration to ICSOFT-EA allows free access to all other ICSOFT conferences.

ICSOFT 2016 will be held in conjunction with DATA 2016.

Registration to ICSOFT allows free access to the DATA conference (as a non-speaker).


Upcoming Deadlines

Regular Paper Camera Ready and Registration: May 19, 2016
Position Paper Authors Notification: May 27, 2016
Position Paper Camera Ready and Registration: June 9, 2016
The purpose of the ICSOFT-EA 2016, the 11th International Conference on Software Engineering and Applications, is to bring together researchers, engineers and practitioners interested on information technology, with a practical focus on software engineering and applications. The conference tracks are "Enterprise Software Technologies", "Software Engineering and Systems Security", "Distributed Systems", and "Software Project Management".

Software technologies are essential for developing any enterprise information system, encompassing a large number of research topics and applications: from programming issues to the more abstract theoretical aspects of software engineering; from software security to mobile applications; Distributed systems, ubiquity, software quality as well as project management and other related topics are included in the scope of ICSOFT-EA.

Conference Chair

Enrique CabelloUniversidad Rey Juan Carlos, Spain


Leszek MaciaszekWroclaw University of Economics, Poland and Macquarie University, Sydney, Australia

Local Chair

Jorge BernardinoPolytechnic Institute of Coimbra - ISEC, Portugal

Keynote Lectures

Uwe AssmannTU-Dresden, Germany
Schahram DustdarVienna University of Technology, Austria
Henry MucciniUniversity of L’Aquila, Italy

Doctoral Consortium

Chair: Jorge Bernardino
Submission: May 20, 2016
Submission: May 31, 2016

All papers presented at the conference venue
will be available at the SCITEPRESS Digital Library

It is planned to publish a short list of revised and
extended versions of presented papers with Springer
in a CCIS Series book

Technically Co-sponsored by:


In Cooperation with:


Proceedings will be submitted for indexation by:

DBLP   Thomson   INSPEC   EI   SCOPUS